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General information
Type CPU / Microprocessor
Market segment Desktop
Family AMD Phenom II X6
Model number ? 1055T
CPU part numbers HDT55TFBK6DGR is an OEM/tray microprocessor
HDT55TFBGRBOX is a boxed microprocessor
Stepping codes ACBBE CB CCBBE CB
Frequency ? 2800 MHz
Turbo frequency 3300 MHz (3 cores or less)
Bus speed ? 667 MHz Memory controller
One 2000 MHz 16-bit HyperTransport link
Clock multiplier ? 14
Package 938-pin organic micro-PGA
Socket Socket AM3
Fan/heatsink AV-Z7UH40Q001-4909
Introduction date April 27, 2010
Price at introduction $199

Architecture / Microarchitecture
Microarchitecture K10
Platform Leo
Processor core ? Thuban
Core stepping ? PH-E0
CPUID 100FA0
Manufacturing process 0.045 micron SOI
Die size 346mm2
Data width 64 bit
The number of cores 6
The number of threads 6
Floating Point Unit Integrated
Level 1 cache size ? 6 x 64 KB instruction caches
6 x 64 KB data caches
Level 2 cache size ? 6 x 512 KB caches
Level 3 cache size 6 MB shared cache
Cache latency 3 (L1 cache)
13 (L2 cache)
48 (L3 cache)
Multiprocessing Uniprocessor
Features
MMX instructions
3DNow! technology
SSE / Streaming SIMD Extensions
SSE2 / Streaming SIMD Extensions 2
SSE3 / Streaming SIMD Extensions 3
SSE4a ?
ABM / Advanced Bit Manipulation ?
AMD64 / AMD 64-bit technology ?
AMD-V / AMD Virtualization technology
EVP / Enhanced Virus Protection ?
Turbo Core technology
Low power features Cool'n'Quiet 3.0

Integrated peripherals / components
Memory controller
The number of controllers: 1
Memory channels: 2
Channel width (bits): 72
Supported memory: DDR2-1066, DDR3-1333
DIMMs per channel: up to 2
Maximum memory bandwidth (GB/s): 21.3
Other peripherals HyperTransport 3.x technology

Electrical / Thermal parameters
V core ? 1.15V - 1.475V (at rated frequency)
1.25V - 1.475V (Turbo Core mode)
1V - 1.225V (Minimum performance state)
V NorthBridge 1.05V - 1.175V
Maximum operating temperature ? 55°C - 62°C
Thermal Design Power 125 Watt