Lake Shore wrote:
但是Exynos 4+4處理器應該是MCP/MCM，不是PoP，因為三星一定是封裝自家的記憶體die跟處理器die在一起，沒理由開放可用別家記憶體..(恕刪)
這個網頁的作者有把Exynos 5410 decap, 在網頁下方的Q&A作者提到
The size of the LPDDR3 is 2GB and it features two DRAM die within the package in a stacked architecture. It is in a PoP orientation with the Octa processor. There is very little gap between the two packages as we had to decap both at the same time to salvage the die.
您的說法某方面是對的, 但考量到Die size, 封裝的良率, 以及搭配不同容量記憶體的彈性, PoP還是較佳的選擇, 事實上Samsung從Exynos 4之後, 若有搭記憶體, 就全是PoP封裝了
Exynos 4
Exynos 5
