Intel Calpella 四核心平台續航力大約？(決定等Q3四核筆電)

Replased from WIKIpedia:

The codename Calpella refers to the sixth-generation Centrino platform; it will be competing with the AMD Fusion platform[citation needed]. It will premiere in Q3 2009 with the second iteration of Nehalem processors.

-Intel QuickPath Interconnect support which directly connects to the CPU, removing the outdated FSB technology.
-Direct connect to DisplayPort with DPCP as with its predecessor along with legacy support for HDMI (and HDCP), DVI, and VGA.
-RAM supported for DDR3-800, DDR3-1066, DDR3-1333 and DDR3-1600 SO-DIMM.
-Solid-state drive or Hybrid hard drives support.

- Intel processor (codenamed Auburndale) 45nm for Dual Core version, 35-45W TDP, or
- Intel processor (codenamed Clarksfield) 45nm for Quad Core version, 45-55W TDP.

耗功率(發熱值)都蠻高的
大家認為續航力和現在的 Core 2 微架構比能比較省電嗎？(平均瓦數上升，但全面使用低電壓的DDRIII)

雙核的Calpella是明年Q1上市，今年Q3就有四核的筆電可以用了