General Module Information Module Number: 0 Module Size: 8 GBytes Memory Type: DDR4 SDRAM Module Type: SO-DIMM Memory Speed: 1066.1 MHz (DDR4-2132 / PC4-17000) Module Manufacturer: SK Hynix Module Part Number: Module Revision: 0.0 Module Serial Number: Module Manufacturing Date: Year: 2016, Week: Module Manufacturing Location: 1 SDRAM Manufacturer: SK Hynix
Module Characteristics Row Address Bits: 15 Column Address Bits: 10 Module Density: 4096 Mb Number Of Ranks: 2 Device Width: 8 bits Bus Width: 64 bits Die Count: 1 Module Nominal Voltage (VDD): 1.2 V Minimum SDRAM Cycle Time (tCKAVGmin): 0.93800 ns Maximum SDRAM Cycle Time (tCKAVGmax): 1.50000 ns CAS# Latencies Supported: 9, 11, 12, 13, 14, 15, 16 Minimum CAS# Latency Time (tAAmin): 13.500 ns Minimum RAS# to CAS# Delay (tRCDmin): 13.500 ns Minimum Row Precharge Time (tRPmin): 13.500 ns Minimum Active to Precharge Time (tRASmin): 33.000 ns
Supported Module Timing at 1066.1 MHz: 15-15-15-36 Supported Module Timing at 1000.0 MHz: 14-14-14-33 Supported Module Timing at 933.3 MHz: 13-13-13-31 Supported Module Timing at 866.7 MHz: 12-12-12-29 Supported Module Timing at 800.0 MHz: 11-11-11-27 Supported Module Timing at 666.7 MHz: 9-9-9-22 Supported Module Timing at 600.0 MHz: 9-9-9-20
Minimum Active to Active/Refresh Time (tRCmin): 46.500 ns Minimum Refresh Recovery Time Delay (tRFC1min): 260.000 ns Minimum Refresh Recovery Time Delay (tRFC2min): 160.000 ns Minimum Refresh Recovery Time Delay (tRFC4min): 110.000 ns Minimum Four Activate Window Delay Time (tFAWmin): 21.000 ns Minimum Active to Active Delay Time - Different Bank Group (tRRD_Smin): 3.700 ns Minimum Active to Active Delay Time - Same Bank Group (tRRD_Lmin): 5.300 ns Minimum CAS to CAS Delay Time - Same Bank Group (tCCD_Lmin): 5.628 ns
Features Module Temperature Sensor (TSOD): Not Supported Temperature Sensor Location: Front Side Module Nominal Height: 29 - 30 mm Module Maximum Thickness (Front): 1 - 2 mm Module Maximum Thickness (Back): 1 - 2 mm Address Mapping from Edge Connector to DRAM: Mirrored